The Stratus high throughput electro-deposition system integrates the wafer quality and process advantages of thin boundary layer deposition with the economic advantages of parallel processing.

Stratus is optimized for long deposition time processes. Stratus is less than 50% the cost per throughput of competing fountain plating systems for applications such as gold and solder wafer bumping, redistribution layers, integrated passives, and various MEMS layers.

Stratus is built around a patented wafer holding module that simultaneously creates a fluid seal and a uniform electrical contact to the wafer surface perimeter. Two wafers are simultaneously held back-to-back in a fail-safe configuration. Stratus’ wafer holder achieves precise alignment between the wafer and critical process elements, enabling small process cell size and more space-efficient system configurations.

Stratus’ modular architecture permits a system layout optimized to your process and throughput requirements — from R&D systems to a multi-metal 40 wafer per hour production system.

The Stratus is designed for the long deposition time processes typically associated with solder and gold bumping or thick copper structures, as well as various MEMS layers.

There are three models:
• Stratus 100 — 150/200 mm manual system for development and low volume production
• Stratus 200 — 150/200 mm automated system for production
• Stratus 300 — 200/300 mm automated system for production