Ultra uniform single-sided wafer thinning and stress relief system

Patented and Proprietary Features
Our patented Linear Scan™ and Dynamic Confinement™ technologies. Allow the WaveEtch™ These are responsible for the very high uniformity and true single sided processing.

Software
WaveEtch™ systems incorporate MATECH’s own WaveSoft™ suite of
process and system control software. All hardware features, system devices, and accessories are controlled from a seamlessly integrated user friendly graphical interface.
The control system allows for different password protected user levels. Process recipes can be edited in-situ as well as off-line and downloaded to the system. WaveSoft™ software also has an emulation mode that lets the user “run” process recipes without actually running any hardware. This
feature is useful when writing and debug complex process recipes.
WaveSoftTMThe software controls all chemical handling functions as well as an integral parts of the process.

Main Applications
The WaveEtch™ systems are capable of running virtually any wet process with better uniformity, truly single-sided and with tighter process control.
All of this while consuming a fraction of the chemicals in standard spin and spray technologies

Common applications

• Wafer stress relief
• Wafer thinning
• Pattern etch
• Stripping
• Oxide removal
• Nitride removal
• Other film removal
• Wafer cleaning